sfh 4056 ir-lumineszenzdiode (850 nm) mit hoher ausgangsleistung high power infrared emitter (850 nm) lead (pb) free produc t - rohs compliant 2010-11-09 1 wesentliche merkmale ? sehr kleines geh?use: (lxbxh) 3.2 mm x 1.6mm x 1 mm ? sehr hohe gesamtleistung anwendungen ? miniaturlichtschranken ? mobile ger?te ? n?herungssensor ? ?messen/steuern/regeln? sicherheitshinweise je nach betriebsart emi ttieren diese bauteile hochkonzentrierte, nicht sichtbare infrarot- strahlung, die gef?hrlich fr das menschliche auge sein kann. produkte, die diese bauteile enthalten, mssen gem?? den sicherheits- richtlinien der iec-normen 60825-1 und 62471 behandelt werden. typ type bestellnummer ordering code strahlst?rkegruppierung 1) ( i f = 70 ma, t p = 20 ms) radiant intensity grouping 1) i e (mw/sr) sfh 4056 q65110a9942 16 (typ. 35) 1) gemessen bei einem raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr features ? very small package: (lxwxh) 3.2 mm x 1.6 mm x 1 mm ? high optical total power applications ? miniature photointerrupters ? mobile devices ? proximity sensor ? for drive and control circuits safety advices depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. products which incorporate these devices have to follow the safety precautions given in iec 60825-1 and iec 62471.
2010-11-09 2 sfh 4056 grenzwerte ( t a = 25 c) maximum ratings bezeichnung parameter symbol symbol wert value einheit unit betriebs- und lagertemperatur operating and storage temperature range t op , t stg ? 40 + 85 c sperrspannung reverse voltage v r 5 v vorw?rtsgleichstrom forward current i f 70 ma sto?strom, t p = 10 s, d = 0 surge current i fsm 700 ma verlustleistung power dissipation p tot 140 mw w?rmewiderstand sperrschicht - umgebung bei montage auf fr4 platine, padgr??e je 5 mm 2 thermal resistance junction - ambient mounted on pc-board (fr4), padsize 5 mm 2 each w?rmewiderstand sperrschicht - l?tstelle bei montage auf metall-block thermal resistance junc tion - soldering point, mounted on metal block r thja r thjs 540 360 k/w k/w elektrostatische entladung (hbm) electrostatic discharge (hbm) esd 2 kv kennwerte ( t a = 25 c) characteristics bezeichnung parameter symbol symbol wert value einheit unit wellenl?nge der strahlung wavelength at peak emission i f = 70 ma, t p = 10 ms peak 860 nm schwerpunkts-wellenl ?nge der strahlung centroid wavelength i f = 70 ma, t p = 10 ms centroid 850 nm spektrale bandbreite bei 50% von i max spectral bandwidth at 50% of i max i f = 70 ma, t p = 10 ms ? 42 nm abstrahlwinkel half angle ? 22 grad deg.
sfh 4056 2010-11-09 3 aktive chipfl?che active chip area a 0.04 mm 2 abmessungen der aktiven chipfl?che dimension of the active chip area l b l w 0.2 0.2 mm2 schaltzeiten, i e von 10% auf 90% und von 90% auf 10%, bei i f = 70 ma, r l = 50 switching times, e from 10% to 90% and from 90% to 10%, i f = 70 ma, r l = 50 t r , t f 12 ns durchlassspannung forward voltage i f = 70 ma, t p = 20 ms v f 1.6 ( < 2.0) v sperrstrom reverse current i r not designed for reverse operation a gesamtstrahlungsfluss total radiant flux i f = 70 ma, t p = 20 ms e typ 40 mw temperaturkoeffizient von i e bzw. e , i f = 70 ma temperature coefficient of i e or e , i f = 70 ma tc i ? 0.5 %/k temperaturkoeffizient von v f , i f = 70 ma temperature coefficient of v f , i f = 70 ma tc v ? 0.7 mv/k temperaturkoeffizient von , i f = 70 ma temperature coefficient of , i f = 70 ma tc + 0.3 nm/k kennwerte ( t a = 25 c) characteristics (cont?d) bezeichnung parameter symbol symbol wert value einheit unit
2010-11-09 4 sfh 4056 abstrahlcharakteristik radiation characteristics i rel = f ( ? ) strahlst?rke i e in achsrichtung 1) gemessen bei einem raumwinkel = 0.01 sr radiant intensity i e in axial direction at a solid angle of = 0.01 sr bezeichnung parameter symbol werte values einheit unit sfh 4056 -s -t -u strahlst?rke radiant intensity i f = 70 ma, t p = 20 ms i e min i e max 16 32 25 50 40 80 mw/sr mw/sr strahlst?rke radiant intensity i f = 500 ma, t p = 25 s i e typ 90 140 225 mw/sr 1) nur eine gruppe in einer verpackungs einheit (streuung kleiner 2:1) / only one bin in one packing unit (variation lower 2:1) ohf04383 0? 20? 40? 60? 80? 100? 120? 0.4 0.6 0.8 1.0 100? 90? 80? 70? 60? 50? 0? 10? 20? 30? 40? 0 0.2 0.4 0.6 0.8 1.0 ?
sfh 4056 2010-11-09 5 relative spectral emission i rel = f ( ) forward current i f = f ( v f ) single pulse, t p = 100 s 700 0 nm % ohf04135 20 40 60 80 100 950 750 800 850 i rel ohf03826 f i 10 -4 0.5 1 1.5 2 2.5 v3 10 0 a 0 f v -1 10 5 5 10 -2 -3 5 10 radiant intensity single pulse, t p = 25 s permissible pulse handling capability i f = f ( ), t a = 25 c, duty cycle d = parameter i e i e 70 ma = f ( i f ) ohf04406 i f ma 10 5 10 5 10 10 3 1 10 -2 10 -3 10 5 10 10 5 -1 5 0 e (70 ma) i e i 012 10 10 0 -2 -3 -4 -5 10 10 10 f i a p t = d t 2 1 0 -1 10 t p 10 s 10 ohf04265 t t p i f 0.1 0.2 0.3 0.4 0.5 0.6 0.8 0.7 0.03 0.2 0.1 0.05 0.02 0.01 0.005 = d 1 0.5 max. permissible forward current i f = f ( t a ), r thja = 540 k/w permissible pulse handling capability i f = f ( ), t a = 85 c, duty cycle d = parameter 0 0 ?c t i f ma ohf04264 a 20 40 60 80 100 10 20 30 40 50 60 70 80 10 10 0 -2 -3 -4 -5 10 10 10 f i a p t = d t 2 1 0 -1 10 t p 10 s 10 ohf04266 t t p i f 0.1 0.2 0.3 0.4 0.5 0.6 0.8 0.7 0.03 0.2 0.1 0.05 0.02 0.01 0.005 = d 1 0.5
2010-11-09 6 sfh 4056 ma?zeichnung package outlines ma?e in mm/ dimensions in mm . geh?use / package chip led/ chip led farbe / colour schwarz / black geh?usemarkierung/ package marking pad 1: kathode / cathode pad 2: anode / anode (anode marking) gewicht/ approx. weight 5.3mg
sfh 4056 2010-11-09 7 gurtung / polarit?t und lage verpackungseinheit 2000/rolle, ?180 mm method of taping / polarity and orientation packing unit 2000/reel, ?180 mm ma?e in mm (inch) / dimensions in mm (inch). empfohlenes l?tpaddesign reflow l?ten recommended solder pad reflow soldering ma?e in mm / dimensions in mm.
2010-11-09 8 sfh 4056 l?tbedingungen vorbehandlung nach jedec level 3 soldering conditions preconditioning acc. to jedec level 3 reflow l?tprofil fr bleifreies l?ten (nach j-std-020-d.01) reflow soldering profile for lead free soldering (acc. to j-std-020-d.01 ) pb-free (snagcu) assembly profile feature recommendation max. ratings ramp-up rate to preheat* ) 25c to 150c 2c / sec 3c / sec time t s from t smin to t smax (150c to 200c 100s min. 60sec max. 120sec ramp-up rate to peak* ) t smax to t p 2c / sec 3c / sec liquidus temperture t l 217c time t l above t l 80sec max. 100sec peak temperature t p 245c max. 260c time t p within 5c of the specified peak temperature t p - 5k 20sec min. 10sec max. 30sec ramp-down rate* t p to 100c 3c / sec 6c / sec maximum time 25c to peak temperature max. 8 min. all temperatures refer to the center of th e package, measured on the top of the component * slope calculation t/ t: t max. 5 sec; fulfillment for the whole t-range 0 0 s oha04525 50 100 150 200 250 300 50 100 150 200 250 300 t t ?c s t t p t t p 240 ?c 217 ?c 245 ?c 25 ?c l
sfh 4056 2010-11-09 9 published by osram opto semico nductors gmbh leibnizstrasse 4, d-93055 regensburg www.osram-os.com ? all rights reserved. the information describes the type of component and shall not be considered as assured characteristics. terms of delivery and rights to change design reserv ed. due to technical requirements components may contain dangerous substances. for information on the types in question please contact our sales organization. packing please use the recycling operators known to you. we can also help you ? get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of tr ansport. for packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. components used in life-support devices or system s must be expressly authorized for such purpose! critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of osram os. 1 a critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support de vice or system, or to affect its safety or effectiveness of that device or system. 2 life support devices or systems are intended (a) to be impl anted in the human body, or (b) to support and/or maintain and sustain human life. if they fail, it is reasonable to assume that the health of the user may be endangered.
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